Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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04/05/2016
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Application #:
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14287603
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Filing Dt:
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05/27/2014
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Publication #:
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Pub Dt:
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12/18/2014
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Inventors:
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Kirk POWELL, John McMILLAN, Adonis FUNG, Serafin P. PEDRON JR.
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Title:
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LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| QPL INDUSTRIAL BUILDING |
| 14TH FLOOR |
| TSUEN WAN, NEW TERRITORIES, HONG KONG |
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| WINSTEAD PC |
| P.O. BOX 131851 |
| DALLAS, TX 75313 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| UNIT E, 9TH FLOOR METEX HOUSE |
| 28 FUI YIU KOK STREET |
| TSUEN WAN, NEW TERRITORIES, HONG KONG |
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| WINSTEAD PC |
| P.O. BOX 131851 |
| DALLAS, TX 75313 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
4
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CORRECTIVE ASSIGNMENT TO CORRECT THE ADD ANNEX INADVERTENTLY LEFT OUT ORIGINAL ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 037880 FRAME: 0534. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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