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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/19/2016
Application #:
14572763
Filing Dt:
12/16/2014
Publication #:
Pub Dt:
07/30/2015
Inventors:
Kwang Soo Kim, Kee Ju Um, SukHo Lee, Joon Seok Chae
Title:
LEADLESS PACKAGE TYPE POWER SEMICONDUCTOR MODULE
Assignment: 1
Reel/Frame:
034534/0378Recorded: 12/17/2014Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/29/2014
Exec Dt:
08/29/2014
Exec Dt:
08/29/2014
Exec Dt:
08/29/2014
Assignee:
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU,SUWON-SI
GYEONGGI-DO, KOREA, REPUBLIC OF 443-743
Correspondent:
LADAS & PARRY LLP
5670 WILSHIRE BLV D.
SUITE 2100
LOS ANGELES, CA 90036-5679

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