Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/26/2016
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Application #:
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14584616
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Filing Dt:
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12/29/2014
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Publication #:
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Pub Dt:
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07/02/2015
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Inventor:
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Xiaochun TAN
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Title:
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MULTI-LEVEL PACKAGE ASSEMBLY HAVING CONDUCTIVE VIAS COUPLED TO CHIP CARRIER FOR EACH LEVEL AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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A1501, TECHNOLOGY MANSION, EASTERN SOFTWARE PARK |
NO. 90 WENSAN ROAD |
HANGZHOU, ZHEJIANG, CHINA |
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BEYER LAW GROUP LLP |
P. O. BOX 51887 |
PALO ALTO, CA 94303-1887 |
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