Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/03/2016
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Application #:
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14598007
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Filing Dt:
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01/15/2015
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Publication #:
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Pub Dt:
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05/07/2015
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Inventors:
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Koji WATANABE, Masahiko KANNO, Masahiko ABE, Hideaki TAKAHASHI, Masaya ITO
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Title:
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SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23, SENJU-HASHIDO-CHO, ADACHI-KU |
TOKYO, JAPAN 120-8555 |
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DONALD B. HASLETT |
601 SW SECOND AVENUE |
SUITE 1600 |
PORTLAND, OR 97204-3157 |
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04/27/2024 03:24 AM
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