Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/17/2016
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Application #:
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14111898
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Filing Dt:
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10/15/2013
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Publication #:
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Pub Dt:
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02/06/2014
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Inventor:
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Tetsuro Nishimura
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Title:
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LEAD-FREE SOLDER ALLOY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16-15, ESAKA-CHO 1-CHOME, SUITA-SHI |
| OSAKA, JAPAN 5640063 |
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| BOZICEVIC, FIELD & FRANCIS LLP |
| 1900 UNIVERSITY AVE., SUITE 200 |
| EAST PALO ALTO, CA 94303 |
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