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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/17/2016
Application #:
14280731
Filing Dt:
05/19/2014
Publication #:
Pub Dt:
11/19/2015
Inventors:
Yang Du, Karim Arabi
Title:
THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) AND RELATED SYSTEMS
Assignment: 1
Reel/Frame:
033062/0387Recorded: 06/10/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/04/2014
Exec Dt:
06/05/2014
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121
Correspondent:
W&T/QUALCOMM
100 REGENCY FOREST DRIVE
SUITE 160
CARY, NC 27518

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