Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/31/2016
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Application #:
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14459520
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Filing Dt:
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08/14/2014
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Publication #:
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Pub Dt:
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12/04/2014
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Inventors:
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Chul KIM, Jong Chern LEE
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Title:
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METHOD OF FABRICATING SEMICONDUCTOR APPARATUS WITH THROUGH-SILICON VIA AND METHOD OF FABRICATING STACK PACKAGE INCLUDING THE SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF |
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| WILLIAM PARK & ASSOCIATE |
| 930 N. YORK ROAD, SUITE 201 |
| HINSDALE, IL 60521 |
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