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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9356066
Issue Dt:
05/31/2016
Application #:
13898641
Filing Dt:
05/21/2013
Publication #:
20140264682
Pub Dt:
09/18/2014
Inventors:
Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu et al
Title:
INTERCONNECT SRUCTURE FOR STACKED DEVICE AND METHOD
Assignment: 1
Reel/Frame:
030455/0892Recorded: 05/21/2013Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHUANG, CHUN-CHIEH
Exec Dt:
04/24/2013
YAUNG, DUN-NIAN
Exec Dt:
05/06/2013
LIU, JEN-CHENG
Exec Dt:
05/06/2013
HUNG, FENG-CHI
Exec Dt:
04/29/2013
HSU, TZU-HSUAN
Exec Dt:
05/02/2013
TSAI, SHU-TING
Exec Dt:
04/24/2013
KAO, MIN-FENG
Exec Dt:
04/24/2013
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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