Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/07/2016
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Application #:
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14220336
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Filing Dt:
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03/20/2014
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Publication #:
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Pub Dt:
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09/24/2015
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Inventors:
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HeeJo Chi, HanGil Shin, NamJu Cho
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Title:
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Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 605 W. KNOX ROAD |
| SUITE 104 |
| TEMPE, AZ 85284 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 500 LINJIANG ROAD |
| YUECHENG DISTRICT |
| SHAOXING, CHINA |
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| ROBERT D. ATKINS |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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