Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/14/2016
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Application #:
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14290572
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Filing Dt:
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05/29/2014
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Publication #:
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Pub Dt:
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07/02/2015
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Inventor:
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Qwan Ho CHUNG
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Title:
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SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON, KOREA, REPUBLIC OF 467-734 |
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| AMPACC LAW GROUP, PLLC |
| 6100 219TH ST. SW |
| SUITE 580 |
| MOUNTLAKE TERRACE, WA 98043 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9330 LBJ FREEWAY |
| SUITE 900 |
| DALLAS, TEXAS 75243 |
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| ROBERT D. LEONARD |
| VOLPE KOENIG |
| 30 SOUTH 17TH STREET, 18TH FLOOR |
| PHILADELPHIA, PA 19103 |
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