Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/14/2016
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Application #:
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13955246
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Filing Dt:
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07/31/2013
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Publication #:
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Pub Dt:
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02/06/2014
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Inventors:
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Alexis Bedoin, Baptiste Goubault de Brugiere
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Title:
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Flip-Chip Assembly Process for Connecting Two Components to Each Other
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 25 RUE LEBLANC |
| BATIMENT LE PONANT D |
| PARIS, FRANCE F-75015 |
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| MARK B. WILSON |
| 98 SAN JACINTO BLVD. |
| SUITE 1100 |
| AUSTIN, TX 78701 |
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