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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/28/2016
Application #:
14242802
Filing Dt:
04/01/2014
Publication #:
Pub Dt:
08/07/2014
Inventors:
Yung-Ho Chuang, Richard W. Solarz, David R. Shafer, Bin-Ming Benjamin Tsai et al
Title:
EUV HIGH THROUGHPUT INSPECTION SYSTEM FOR DEFECT DETECTION ON PATTERNED EUV MASKS, MASK BLANKS, AND WAFERS
Assignment: 1
Reel/Frame:
032577/0467Recorded: 04/01/2014Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/25/2014
Exec Dt:
03/26/2014
Exec Dt:
03/27/2014
Exec Dt:
03/26/2014
Exec Dt:
03/23/2014
Assignee:
ONE TECHNOLOGY DRIVE
MILPITAS, CALIFORNIA 95035
Correspondent:
BEVER, HOFFMAN & HARMS, LLP
901 CAMPISI WAY
SUITE 370
CAMPBELL, CA 95008

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