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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/19/2016
Application #:
14647092
Filing Dt:
05/25/2015
Publication #:
Pub Dt:
11/05/2015
Inventors:
Hong HU, Qingming SHU, Sai ZHANG, Jianjun ZHANG, Jiang LIU
Title:
ENHANCED FLASH CHIP AND METHOD FOR PACKAGING CHIP
Assignment: 1
Reel/Frame:
035704/0074Recorded: 05/25/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/23/2015
Exec Dt:
03/23/2015
Exec Dt:
03/23/2015
Exec Dt:
03/23/2015
Exec Dt:
03/23/2015
Assignee:
SUITE 01-15, A12, TIANGONG BUILDING XUEYUAN ROAD NO. 30, HAIDIAN DISTRICT
BEIJING, CHINA 100083
Correspondent:
GOKALP BAYRAMOGLU
8275 SOUTH EASTERN AVENUE SUITE 200-611
LAS VEGAS, NV 89123
Assignment: 2
Reel/Frame:
061668/0819Recorded: 10/13/2022Pages: 9
Conveyance:
CHANGE OF NAME & ADDRESS
Assignor:
Exec Dt:
07/29/2022
Assignee:
NO.8, IC PARK, NO.9 FENGHAO EAST ROAD, HAIDIAN
BEIJING, CHINA 100094
Correspondent:
CPA GLOBAL LIMITED
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY

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