Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/19/2016
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Application #:
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14354583
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Filing Dt:
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07/02/2014
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Publication #:
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Pub Dt:
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12/03/2015
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Inventors:
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Fei Qin, Guofeng Xia, Tong An, Wei Wu, Chengyan Liu, Wenhui Zhu
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Title:
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Package in Package (PiP) Electronic Device and Manufacturing Method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100 # PINGLEYUAN, CHAOYANG DISTRICT |
| BEIJING, CHINA 100124 |
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| HAN IP CORPORATION |
| 4790 IRVINE BOULEVARD SUITE 105-347 |
| IRVINE, CA 92620 |
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