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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/09/2016
Application #:
13830126
Filing Dt:
03/14/2013
Publication #:
Pub Dt:
09/18/2014
Inventors:
Danish Faruqui, David K. Wilkinson JR., Rajen C. Dias, Mihir A. Oka, Edward R. Prack et al
Title:
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
Assignment: 1
Reel/Frame:
030798/0233Recorded: 07/15/2013Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/13/2013
Exec Dt:
07/12/2013
Exec Dt:
03/11/2013
Exec Dt:
03/08/2013
Exec Dt:
03/11/2013
Exec Dt:
07/10/2013
Exec Dt:
03/12/2013
Exec Dt:
03/11/2013
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
SCHWABE, WILLIAMSON & WYATT, P.C.
1211 SW 5TH AVENUE, SUITE 1900
PORTLAND, OR 97204
Assignment: 2
Reel/Frame:
030797/0172Recorded: 07/15/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/14/2013
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
SCHWABE, WILLIAMSON & WYATT, P.C.
1211 SW 5TH AVENUE, SUITE 1900
PORTLAND, OR 97204

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