Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/09/2016
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Application #:
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13503126
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Filing Dt:
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08/03/2012
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Publication #:
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Pub Dt:
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12/19/2013
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Inventors:
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Yoshiyuki Nagatomo, Kazuhiro Akiyama, Hiroshi Tonomura, Nobuyuki Terasaki et al
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Title:
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SUBSTRATE FOR POWER MODULE, SUBSTRATE WITH HEAT SINK FOR POWER MODULE, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE WITH HEAT SINK FOR POWER MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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| LOCKE LORD LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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