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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
09/13/2016
Application #:
13063050
Filing Dt:
03/09/2011
Publication #:
Pub Dt:
07/07/2011
Inventors:
Atsushi Fukushima, Yuichiro Shindo, Susumu Shimamoto
Title:
High-Purity Copper or High-Purity Copper Alloy Sputtering Target, Process for Manufacturing the Sputtering Target, and High-Purity Copper or High-Purity Copper Alloy Sputtered Film
Assignment: 1
Reel/Frame:
025932/0663Recorded: 03/10/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/28/2011
Exec Dt:
02/28/2011
Exec Dt:
02/28/2011
Assignee:
6-3, OTEMACHI 2-CHOME
CHIYODA-KU
TOKYO, JAPAN 100-8164
Correspondent:
WILLIAM BAK, HOWSON & HOWSON LLP
501 OFFICE CENTER DRIVE
SUITE 210
FORT WASHINGTON, PA 19034
Assignment: 2
Reel/Frame:
042109/0069Recorded: 03/29/2017Pages: 12
Conveyance:
CHANGE OF ADDRESS
Assignor:
Exec Dt:
01/16/2016
Assignee:
1-2, OTEMACHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
CPA GLOBAL LIMITED
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY
Assignment: 3
Reel/Frame:
057160/0114Recorded: 08/11/2021Pages: 20
Conveyance:
CHANGE OF ADDRESS
Assignor:
Exec Dt:
06/29/2020
Assignee:
10-4, TORANOMON 2-CHOME, MINATO-KU
TOKYO, JAPAN 100-8164
Correspondent:
CPA GLOBAL LIMITED
LIBERATION HOUSE
CASTLE ST
ST HELIER, JE1 1BL JERSEY

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