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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9443796
Issue Dt:
09/13/2016
Application #:
13895122
Filing Dt:
05/15/2013
Publication #:
20140264948
Pub Dt:
09/18/2014
Inventors:
Bruce C.S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang et al
Title:
AIR TRENCH IN PACKAGES INCORPORATING HYBRID BONDING
Assignment: 1
Reel/Frame:
030639/0153Recorded: 06/19/2013Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHOU, BRUCE C.S.
Exec Dt:
04/06/2013
WANG, CHEN-JONG
Exec Dt:
05/06/2013
LIU, PING-YIN
Exec Dt:
05/06/2013
TU, JUNG-KUO
Exec Dt:
05/06/2013
CHOU, TSUNG-TE
Exec Dt:
05/06/2013
HUANG, XIN-HUA
Exec Dt:
05/06/2013
KUANG, XIN-CHUNG
Exec Dt:
05/06/2013
CHAO, LAN-LIN
Exec Dt:
05/06/2013
TSAI, CHIA-SHIUNG
Exec Dt:
04/06/2013
CHEN, XIAOMENG
Exec Dt:
04/06/2013
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77 R.O.C.
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON ROAD
SUITE 1000
DALLAS, TX 75252
Assignment: 2
Reel/Frame:
041901/0060Recorded: 03/07/2017Pages: 9
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT THE 7TH INVENTOR'S NAME PREVIOUSLY RECORDED ON REEL 030639 FRAME 0153. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.
Assignors:
CHOU, BRUCE C.S.
Exec Dt:
01/19/2017
WANG, CHEN-JONG
Exec Dt:
01/10/2017
LIU, PING-YIN
Exec Dt:
02/08/2017
TU, JUNG-KUO
Exec Dt:
01/19/2017
CHOU, TSUNG-TE
Exec Dt:
01/19/2017
HUANG, XIN-HUA
Exec Dt:
01/08/2017
KUANG, HSUN-CHUNG
Exec Dt:
02/09/2017
CHAO, LAN-LIN
Exec Dt:
02/08/2017
TSAI, CHIA-SHIUNG
Exec Dt:
02/08/2017
CHEN, XIAOMENG
Exec Dt:
02/23/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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