Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/20/2016
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Application #:
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14288130
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Filing Dt:
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05/27/2014
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Publication #:
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Pub Dt:
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12/04/2014
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Inventors:
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Kevin Formosa, Luca Maggi
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Title:
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WAFER-LEVEL PACKAGING OF INTEGRATED DEVICES, AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| VIA C. OLIVETTI, 2 |
| AGRATE BRIANZA, ITALY 20864 |
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| INDUSTRIAL CENTER, INDUSTRIES ROAD |
| KIRKOP, MALTA ZRQ 10 |
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| KAREN M. HENCKEL |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104-7092 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| 1228 PLAN-LES-OUATES |
| GENEVA, SWITZERLAND |
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| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE, SUITE 300 |
| COPPELL, TX 75019 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| 1228 PLAN-LES-OUATES |
| GENEVA, SWITZERLAND |
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| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE |
| SUITE 300 |
| COPPELL, TX 75019 |
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