Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/25/2016
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Application #:
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13679154
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Filing Dt:
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11/16/2012
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Publication #:
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Pub Dt:
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05/16/2013
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Inventors:
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King-Ning TU, Chih CHEN, Taochi LIU
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Title:
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Electrodeposited Nano-Twins Copper Layer and Method of Fabricating the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1001, DAXUE RD., EAST DIST., |
| HSINCHU CITY, TAIWAN 300 |
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| MUNCY, GEISSLER, OLDS & LOWE, PLLC |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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