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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/15/2016
Application #:
14764755
Filing Dt:
07/30/2015
Publication #:
Pub Dt:
12/24/2015
Inventors:
Hiroyuki MORITA, Yasuko WADA, Hiroshi YAMAUCHI, Satoshi HANEDA
Title:
THERMALLY EXPANDING MICROCAPSULES
Assignment: 1
Reel/Frame:
036219/0863Recorded: 07/30/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/21/2015
Exec Dt:
07/21/2015
Exec Dt:
07/21/2015
Exec Dt:
07/21/2015
Assignees:
4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI
OSAKA, JAPAN 5300047
4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI
OSAKA, JAPAN 5300047
Correspondent:
WENDEROTH, LIND & PONACK, L.L.P.
1030 15TH STREET, NW
SUITE 400 EAST
WASHINGTON, DC 20005

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