Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/29/2016
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Application #:
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15050587
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Filing Dt:
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02/23/2016
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Publication #:
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Pub Dt:
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09/29/2016
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Inventors:
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Jiaming Ye, Junli Shentu
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Title:
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CHIP PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| A1501 TECHNOLOGY MANSION, NO. 90 WENSAN ROAD |
| HANGZHOU, ZHEJIANG PROVINCE, CHINA 310012 |
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| MICHAEL C. STEPHENS, JR. |
| 22779 MONTROSE COURT |
| LOS GATOS, CA 95033 |
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