Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/29/2016
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Application #:
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14971384
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Filing Dt:
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12/16/2015
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Inventors:
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Javier A. Delacruz, Belgacem Haba, Tu Tam Vu, Rajesh Katkar
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Title:
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Flipped Die Stacks With Multiple Rows Of Leadframe Interconnects
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| INVENSAS CORPORATION |
| 3025 ORCHARD PARKWAY |
| ATTN: PATENT DEPT. |
| SAN JOSE, CA 95134 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| LDLK&M |
| 600 SOUTH AVENUE WEST |
| WESTFIELD, NJ 07090 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 NORTH TRYON STREET |
| CHARLOTTE, NORTH CAROLINA 28255 |
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| STEWART WALSH |
| 1025 VERMONT AVE NW, SUITE 1130 |
| COGENCY GLOBAL INC. |
| WASHINGTON, DC 20005 |
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