Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/29/2016
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Application #:
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15022408
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Filing Dt:
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03/16/2016
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Publication #:
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Pub Dt:
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08/11/2016
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Inventors:
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Takeshi OMARU, Hideo KOMO, Shoji SAITO
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Title:
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SEMICONDUCTOR DEVICE MODULE WITH SOLDER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1008310 |
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| STUDEBAKER & BRACKETT PC |
| 12700 SUNRISE VALLEY DRIVE |
| SUITE 102 |
| RESTON, VA 20191 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-5 BURTON HALL ROAD |
| SANDYFORD |
| DUBLIN, IRELAND 18 |
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| SHAMI MESSINGER PLLC |
| 1000 WISCONSIN AVE NW |
| SUITE 200 |
| WASHINGTON, DC 20007 |
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