Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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12/06/2016
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Application #:
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13530751
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Filing Dt:
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06/22/2012
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Publication #:
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Pub Dt:
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02/21/2013
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Inventors:
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Huiying Yang, Daoqiang Lu
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Title:
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SOLDER PASTE COMPOSITION, A SOLDER PASTE AND A SOLDERING FLUX
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HENKELSTRASSE 67 |
| DUESSELDORF, GERMANY 40589 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HENKELSTRASSE 67 |
| DUESSELDORF, GERMANY 40589 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HENKELSTRASSE 67 |
| DUESSELDORF, GERMANY 40589 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NIHONBASHI SAKURADORI BLDG. 5TH FLOOR |
| 3-8-4 NIHONBASHI, CHUO-KU |
| TOKYO, JAPAN 103-0027 |
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| BUCHANAN INGERSOLL & ROONEY |
| 1737 KING STREET |
| ALEXANDRIA, VA 22314 |
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