Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/06/2016
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Application #:
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14547673
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Filing Dt:
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11/19/2014
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Publication #:
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Pub Dt:
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03/12/2015
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Inventors:
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Eun Sung LEE, Sang Soo JEE, Kun Mo CHU, Se Yun KIM, Kyu Hyoung LEE, Sang Mock LEE
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Title:
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HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDING A JUNCTION PART MADE OF THE HEAT DISSIPATION MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO |
| YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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