Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/20/2016
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Application #:
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14235533
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Filing Dt:
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01/28/2014
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Publication #:
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Pub Dt:
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07/03/2014
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Inventors:
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Hideo Tsukamoto, Hideki Hirotsuru, Yosuke Ishihara
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Title:
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HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR ELEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NIHONBASHI-MUROMACHI |
| 2-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-8338 |
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| PEARN & GORDON LLP |
| 1801 E. 9TH ST |
| SUITE 1200 |
| CLEVELAND, OH 44114 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1-1, NIHONBASHI-MUROMACHI 2-CHOME |
| CHUO-KU |
| TOKYO, JAPAN |
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| PEARNE & GORDON LLP |
| 1801 E. 9TH STREET |
| STE 1200 |
| CLEVELAND, OH 44114 |
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