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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/20/2016
Application #:
14499181
Filing Dt:
09/28/2014
Publication #:
Pub Dt:
09/24/2015
Inventors:
Kwang Soo KIM, Joon Seok Chae, Suk Ho Lee
Title:
SEMICONDUCTOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
033843/0935Recorded: 09/29/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/02/2014
Exec Dt:
09/02/2014
Exec Dt:
09/02/2014
Assignee:
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI,
GYEONGGI-DO, KOREA, REPUBLIC OF 443-743
Correspondent:
LADAS & PARRY LLP
5670 WILSHIRE BLVD
SUITE 2100
LOS ANGELES, CA 90036-5679

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