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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/24/2017
Application #:
14970549
Filing Dt:
12/16/2015
Inventors:
LINGZI LI, ZHAOBING LI, HUI LU, ZHANG HU SUN
Title:
HIGH-VOLTAGE SEMICONDUCTOR DEVICE WITH FINGER-SHAPED INSULATION STRUCTURE
Assignment: 1
Reel/Frame:
037299/0504Recorded: 12/16/2015Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/17/2015
Exec Dt:
11/17/2015
Exec Dt:
11/17/2015
Exec Dt:
11/17/2015
Assignee:
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU CITY, TAIWAN
Correspondent:
WINSTON HSU
P.O.BOX 506
MERRIFIELD, VA 22116

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