Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/07/2017
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Application #:
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14938944
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Filing Dt:
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11/12/2015
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Publication #:
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Pub Dt:
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03/03/2016
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Inventors:
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Wei Lin, Son V. Nguyen, Spyridon Skordas, Tuan A. Vo
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Title:
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SEMICONDUCTOR PACKAGE WITH STRUCTURES FOR COOLING FLUID RETENTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION - ENDICOTT DRAFTING CENT |
| 2070 ROUTE 52 |
| HOPEWELL JUNCTION, NY 12533 |
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