Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/07/2017
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Application #:
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14586415
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Filing Dt:
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12/30/2014
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Publication #:
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Pub Dt:
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06/30/2016
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Inventors:
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Hai Cong, Juan Boon Tan, Danny Pak-Chum Shum, Yi Jiang
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Title:
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DUAL ENCAPSULATION INTEGRATION SCHEME FOR FABRICATING INTEGRATED CIRCUITS WITH MAGNETIC RANDOM ACCESS MEMORY STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| INGRASSIA FISHER & LORENZ, P.C. (GF) |
| 7010 E. COCHISE RD. |
| SCOTTSDALE, AZ 85253 |
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Assignment:
2
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| 1100 NORTH MARKET STREET |
| WILMINGTON, DELAWARE 19801 |
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| CT CORPORATION |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| BENJAMIN PETERSEN |
| 1460 EL CAMINO REAL, 2ND FLOOR |
| SHEARMAN & STERLING LLP |
| MENLO PARK, CA 94025 |
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