Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/14/2017
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Application #:
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15018734
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Filing Dt:
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02/08/2016
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Inventors:
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Nicolas Boyer, Alexander Janta-Polczynski, Jean-Francois Morissette, Tymon Barwicz et al
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Title:
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COMPONENT AND CHIP ASSEMBLY STRUCTURE FOR HIGH YIELD PARALLELIZED FIBER ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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CANTOR COLBURN LLP-IBM YORKTOWN |
20 CHURCH STREET |
22ND FLOOR |
HARTFORD, CT 06103 |
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