Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/14/2017
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Application #:
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14606274
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Filing Dt:
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01/27/2015
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Publication #:
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Pub Dt:
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07/28/2016
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Inventor:
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Aik Teong Tan
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Title:
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Method of Thinning and Packaging a Semiconductor Chip
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
| 8000 REGENCY PARKWAY |
| SUITE 415 |
| CARY, NC 27518 |
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