Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/14/2017
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Application #:
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14694868
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Filing Dt:
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04/23/2015
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Publication #:
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Pub Dt:
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10/29/2015
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Inventors:
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Fengqin HAN, Jianhong MAO, Zhiwei WANG, Wenfen CHANG
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Title:
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METHODS OF FABRICATION AND TESTING OF THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT SYSTEM-IN-PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 501B, BUILDING #5, 3000 LONG DONG AVENUE, ZHANGJIANG HIGH TECH PARK, PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUITE 316, 4F, NO. 298 LIANZHEN ROAD, PUDONG NEW AREA |
| SHANGHAI, CHINA 201204 |
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| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 4000 LEGATO RD., STE 310 |
| FAIRFAX, VA 22033 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT |
| NINGBO, CHINA 315800 |
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| ANOVA LAW GROUP PLLC |
| 21495 RIDGETOP CIRCLE, SUITE 300 |
| STERLING, VA 20166 |
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