Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/14/2017
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Application #:
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14811534
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Filing Dt:
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07/28/2015
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Publication #:
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Pub Dt:
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02/02/2017
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Inventors:
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Cheng-Te Lee, Chung-Yi Yu, Jen-Cheng Liu, Kuan-Chieh Huang, Yeur-Luen Tu
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Title:
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SEMICONDUCTOR WAFER FOR INTEGRATED PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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