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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/28/2017
Application #:
14411537
Filing Dt:
12/29/2014
Publication #:
Pub Dt:
06/04/2015
Inventors:
Dan Dai, Xinwei Zhang, Guoping Zhou, Changfeng Xia
Title:
MEMS CHIP AND MANUFACTURING METHOD THEREFOR
Assignment: 1
Reel/Frame:
034591/0421Recorded: 12/29/2014Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/22/2014
Exec Dt:
12/22/2014
Exec Dt:
12/22/2014
Exec Dt:
12/22/2014
Assignee:
NO.8 XINZHOU ROAD
WUXI NEW DISTRICT
JIANGSU, CHINA 214028
Correspondent:
NOVAK DRUCE CONNOLLY BOVE + QUIGG LLP
1875 I ST NW
SUITE 1100
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
049018/0616Recorded: 04/29/2019Pages: 6
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/22/2017
Assignee:
NO.8 XINZHOU ROAD
WUXI NEW DISTRICT, JIANGSU, CHINA 214028
Correspondent:
POLSINELLI PC
1401 EYE ST NW
SUITE 800
WASHINGTON, DC 20005-2225

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