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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
02/28/2017
Application #:
14453746
Filing Dt:
08/07/2014
Publication #:
Pub Dt:
02/11/2016
Inventors:
Maciej Wojnowski, Josef Boeck, Ernst Seler, Walter Hartner
Title:
A Transition Between a Plastic Waveguide and a Semiconductor Chip, Where the Semiconductor Chip is Embedded and Encapsulated Within a Mold Compound
Assignment: 1
Reel/Frame:
034374/0055Recorded: 12/04/2014Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/09/2012
Exec Dt:
08/09/2012
Exec Dt:
08/12/2012
Exec Dt:
08/13/2012
Assignee:
ONE MICROSOFT WAY
REDMOND, WASHINGTON 98052
Correspondent:
WOLFE-SBMC
601 W. MAIN AVE.
SUITE 1300
SPOKANE, WA 99201
Assignment: 2
Reel/Frame:
041394/0402Recorded: 01/18/2017Pages: 10
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT APPL. NO. 14/543,746 PREVIOUSLY RECORDED AT REEL: 034374 FRAME: 0055. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
08/09/2012
Exec Dt:
08/09/2012
Exec Dt:
08/12/2012
Exec Dt:
08/13/2012
Assignee:
ONE MICROSOFT WAY
REDMOND, WASHINGTON 98052
Correspondent:
WOLFE-SBMC
116 W. PACIFIC AVE
SUITE 300
SPOKANE, WA 99201
Assignment: 3
Reel/Frame:
034012/0391Recorded: 10/16/2014Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/22/2014
Exec Dt:
08/24/2014
Exec Dt:
08/22/2014
Exec Dt:
08/25/2014
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
8000 REGENCY PARKWAY
SUITE 415
CARY, NC 27518

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