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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/28/2017
Application #:
14260007
Filing Dt:
04/23/2014
Publication #:
Pub Dt:
08/06/2015
Inventors:
Jong In RYU, Eun Jung JO, Do Jae YOO, Jae Hyun LIM, Sun Ho KIM, Kyu Hwan OH
Title:
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
032741/0164Recorded: 04/23/2014Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/04/2014
Exec Dt:
04/04/2014
Exec Dt:
04/04/2014
Exec Dt:
04/04/2014
Exec Dt:
04/04/2014
Exec Dt:
04/04/2014
Assignee:
MAEYOUNG-RO 150 (MAETAN-DONG)
YOUNGTONG-GU, SUWON-SI
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001

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