Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/28/2017
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Application #:
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14434239
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Filing Dt:
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04/08/2015
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Publication #:
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Pub Dt:
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09/15/2016
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PCT #:
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US2014038273
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Inventor:
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Paul J. Gwin
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Title:
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MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHWABE, WILLIAMSON & WYATT, P.C. |
| 1211 SW 5TH AVENUE, SUITE 1900 |
| PORTLAND, OR 97204 |
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