Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/28/2017
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Application #:
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14778684
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Filing Dt:
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09/21/2015
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Publication #:
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Pub Dt:
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02/18/2016
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Inventors:
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Kenji MATSUDA, Yuichi MAKITA, Yusuke OHSHIMA, Junichi TANIUCHI, Dai SHINOZAKI et al
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Title:
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SEMICONDUCTOR DEVICE AND HEAT-DISSIPATING MECHANISM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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TOKYO BUILDING 22F |
7-3, MARUNOUCHI 2-CHOME |
CHIYODA-KU, TOKYO, JAPAN 100-6422 |
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ORRICK, HERRINGTON & SUTCLIFFE LLP |
2050 MAIN STREET, SUITE 1100 |
IRVINE, CA 92614 |
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04/23/2024 01:39 PM
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