Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/28/2017
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Application #:
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14447231
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Filing Dt:
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07/30/2014
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Publication #:
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Pub Dt:
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02/05/2015
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Inventor:
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Takuya NAKABAYASHI
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Title:
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LEAD FRAME, LEAD FRAME WITH RESIN ATTACHED THERETO, RESIN PACKAGE, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING RESIN PACKAGE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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491-100, OKA, KAMINAKA-CHO, ANAN-SHI |
TOKUSHIMA, JAPAN 774-8601 |
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FOLEY & LARDNER LLP |
3000 K STREET NW |
SUITE 500 |
WASHINGTON, DC 20007 |
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