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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9608116
Issue Dt:
03/28/2017
Application #:
14675215
Filing Dt:
03/31/2015
Publication #:
20160240652
Pub Dt:
08/18/2016
Inventors:
Ching-Wei Tsai, Kuo-Cheng Ching, Chi-Wen Liu, Ying-Keung Leung, Chih-Hao Wang
Title:
FINFETS WITH WRAP-AROUND SILICIDE AND METHOD FORMING THE SAME
Assignment: 1
Reel/Frame:
035303/0819Recorded: 03/31/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHING, KUO-CHENG
Exec Dt:
03/23/2015
TSAI, CHING-WEI
Exec Dt:
03/23/2015
LIU, CHI-WEN
Exec Dt:
03/23/2015
WANG, CHIH-HAO
Exec Dt:
03/23/2015
LEUNG, YING-KEUNG
Exec Dt:
03/23/2015
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252
Assignment: 2
Reel/Frame:
050730/0506Recorded: 10/16/2019Pages: 10
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 35303 FRAME: 819. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
CHIANG, KUO-CHENG
Exec Dt:
09/23/2019
TSAI, CHING-WEI
Exec Dt:
09/23/2019
LIU, CHI-WEN
Exec Dt:
09/23/2019
WANG, CHIH-HAO
Exec Dt:
09/23/2019
LEUNG, YING-KEUNG
Exec Dt:
09/24/2019
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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