Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/04/2017
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Application #:
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15345849
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Filing Dt:
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11/08/2016
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Publication #:
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Pub Dt:
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02/23/2017
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Inventors:
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Choung Ki SONG, Chang Hyun KIM
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Title:
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SEMICONDUCTOR APPARATUS INCLUDING MULTICHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON-SI GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF |
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| WILLIAM PARK & ASSOCIATES LTD. |
| 930 N. YORK ROAD, SUITE 201 |
| HINSDALE, IL 60521 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE STATE/COUNTRY PREVIOUSLY RECORDED AT REEL: 040577 FRAME: 0854. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF |
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| WILLIAM PARK & ASSOCIATES LTD. |
| 930 N. YORK ROAD, SUITE 201 |
| HINSDALE, IL 60521 |
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