Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/25/2017
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Application #:
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12025903
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Filing Dt:
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02/05/2008
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Publication #:
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Pub Dt:
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08/14/2008
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Inventors:
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Tomoyuki FUJII, Akio Suzuki
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Title:
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BONDING MATERIAL AND SEMICONDUCTOR SUPPORTING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-56, SUDA-CHO, MIZUHO-KU |
| NAGOYA-SHI, AICHI-KEN, JAPAN |
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| 6-1, OHTEMACHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| BURR & BROWN |
| PO BOX 7068 |
| SYRACUSE, NY 13261-7068 |
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