Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/25/2017
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Application #:
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14123129
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Filing Dt:
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11/29/2013
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Publication #:
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Pub Dt:
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04/10/2014
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Inventors:
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Cornelia Roeger-Goepfert, Marco Arnold, Roman Benedikt Raether, Dieter Mayer et al
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Title:
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COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LUDWIGSHAFEN, GERMANY 67056 |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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