Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/25/2017
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Application #:
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14852335
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Filing Dt:
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09/11/2015
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Publication #:
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Pub Dt:
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03/10/2016
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Inventors:
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Joachim Keinert, Haoxing Ren, Harry Barowski, Sridhar H. Rangarajan, Sourav Saha
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Title:
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THROUGH-SILICON VIA ACCESS DEVICE FOR INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| SCULLY, SCOTT, MURPHY & PRESSER, P.C. |
| 400 GARDEN CITY PLAZA, SUITE 300 |
| GARDEN CITY, NY 11530 |
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