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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9634959
Issue Dt:
04/25/2017
Application #:
14548345
Filing Dt:
11/20/2014
Publication #:
20150289406
Pub Dt:
10/08/2015
Inventors:
Paul W. Coteus, Shawn A. Hall, Todd E. Takken, Fuad E. Doany, Mark D. Schultz et al
Title:
HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS
Assignment: 1
Reel/Frame:
034215/0395Recorded: 11/20/2014Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
COTEUS, PAUL W.
Exec Dt:
11/12/2014
DOANY, FUAD E.
Exec Dt:
11/12/2014
HALL, SHAWN A.
Exec Dt:
11/12/2014
SCHULTZ, MARK D.
Exec Dt:
11/12/2014
TAKKEN, TODD E.
Exec Dt:
11/13/2014
TIAN, SHURONG
Exec Dt:
11/12/2014
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORP. - FISHKILL DRAFTING CENTER
294 ROUTE 100
39-257
SOMERS, NY 10589
Assignment: 2
Reel/Frame:
037161/0654Recorded: 11/27/2015Pages: 2
Conveyance:
CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
Assignor:
INTERNATIONAL BUSINESS MACHINES CORPORATION
Exec Dt:
11/25/2014
Assignee:
U.S. DEPARTMENT OF ENERGY
1000 INDEPENDENCE AVE., S.W.
WASHINGTON, DISTRICT OF COLUMBIA 20585
Correspondent:
BRENDA K. BANKS
1000 INDEPENDENCE AVE.
WASHINGTON, DC 20585

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