Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/02/2017
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Application #:
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14226966
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Filing Dt:
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03/27/2014
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Publication #:
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Pub Dt:
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02/05/2015
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Inventors:
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Bing Dang, John U. Knickerbocker, Cornelia Kang-I Tsang
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Title:
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WAFER DEBONDING USING MID-WAVELENGTH INFRARED RADIATION ABLATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| FRANK V. DEROSA |
| 48 SOUTH SERVICE ROAD, SUITE 100 |
| RYAN, MASON & LEWIS, LLP |
| MELVILLE, NY 11747 |
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