Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/02/2017
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Application #:
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14837245
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Filing Dt:
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08/27/2015
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Publication #:
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Pub Dt:
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06/02/2016
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Inventors:
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Chun-Hsien Lin, Shih-Chao Chiu, Ming-Chen Sun, Tzu-Chieh Shen, Yu-Cheng Pai
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Title:
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PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN |
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| MINTZ LEVIN |
| ONE FINANCIAL CENTER |
| BOSTON, MA 02111 |
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