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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/09/2017
Application #:
14449410
Filing Dt:
08/01/2014
Inventor:
Vladimir V. Dotsenko
Title:
SUPERCONDUCTIVE MULTI-CHIP MODULE FOR HIGH SPEED DIGITAL CIRCUITS
Assignment: 1
Reel/Frame:
033571/0320Recorded: 08/20/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/14/2014
Assignee:
175 CLEARBROOK ROAD
ELMSFORD, NEW YORK 10523
Correspondent:
OSTROLENK FABER LLP
1180 AVENUE OF THE AMERICAS
NEW YORK, NY 10036
Assignment: 2
Reel/Frame:
049412/0196Recorded: 06/07/2019Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/21/2019
Assignee:
175 CLEARBROOK RD
#148
ELMSFORD, NEW YORK 10523
Correspondent:
STEVEN M. HOFFBERG
777 THIRD AVE
22ND FL
NEW YORK, NY 10017

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